Key features & benefits
Process flexibility
The SENTECH SI 591 compact RIE Plasma Etch system facilitates a large number of chlorine and fluorine-based plasma etch processes.
Small footprint and high modularity
The system can be configured as a single reactor or as a cluster tool with cassette-to-cassette loading. The configurations of the single reactor are with a load lock above the system for minimal footprint or with a load lock for through-the-wall installation.
SENTECH control software
SENTECH Plasma Etch tools include user-friendly powerful software with GUI, parameter window, recipe editor, data logging, and user management.
The SENTECH SI 591 compact RIE Plasma Etch system stands for excellent process reproducibility and plasma etching process flexibility due to the vacuum load lock and fully computer-controlled plasma etch process conditions. Flexibility, modularity, and a small footprint are design characteristics of the SENTECH SI 591 compact. Samples up to 200 mm in diameter and carriers can be loaded. The system can be configured for through-the-wall operation or minimal footprint with multiple options.
Flexibility and modularity
The SENTECH SI 591 compact RIE Plasma Etch system combines the advantages of a parallel plate electrode design for RIE with the fully computer-controlled etch process conditions of a load lock system. The system can be configured for processing a variety of materials.
At SENTECH we offer different levels of automation ranging from vacuum cassette loading to one process chamber up to six port cluster with different etch and deposition modules targeted to high flexibility or high throughput. The SENTECH SI 591 compact system is available as a process module on a cluster configuration as well.
The system is controlled by advanced hardware and SIA operating software, with a client-server architecture. A well-proven, reliable programmable logic controller (PLC) is used for the real-time control of all components.
Configurations:
- RIE plasma etching with small footprint
- Load lock
- Corrosive and non-corrosive chemistry
- For up to 200 mm wafers
- Diagnostic windows for laser interferometer and OES
- Configurations of up to 6-port transfer chamber available
- Combination of RIE, ICP-RIE, PECVD, and ALD
- Manual vacuum load lock or cassette station
- Cluster for R & D and high throughput
- SENTECH control software
- RIE plasma etch with a small footprint
- Load lock for through-the-wall integration
- Halogen and fluorine chemistry
- For up to 200 mm wafers
- Diagnostic windows for laser interferometer and OES
