PECVD Systems

Gain insight into our systems with low-damage, low-temperature capabilities for inductively coupled plasma-based CVD deposition processes.

Plasma-enhanced chemical vapour deposition tools

ICPECVD System – SI 500 D

Inductively coupled plasma (ICP) deposition system, the SENTECH SI 500 D for high density, low ion energy, and low-pressure plasma deposition of dielectric films and low-damage, low-temperature deposition for passivation layers.

PECVD Open Lid Plasma Deposition System – Depolab 200

The SENTECH Depolab 200 is the basic plasma-enhanced chemical vapour deposition (PECVD) system suited to the deposition of dielectric films for etching masks, membranes, and electrically isolating films as well as many others.

ICP Deposition System combining PECVD and ALD in one Reactor – SIPAR

The inductively coupled plasma (ICP) deposition system SIPAR combines plasma-enhanced chemical vapour deposition (PECVD) and atomic layer deposition (ALD) in one Reactor.