Precise thickness control and uniformity
Atomic Layer Deposition Explained
When is Plasma-Enhanced Atomic Layer Deposition (PEALD) the Best Plasma Processing Option
Plasma-Enhanced Atomic Layer Deposition (PEALD) is a thin-film deposition method that merges the precision of ALD with the enhanced reactivity of plasma. It is the preferred plasma processing option when ultra-thin, highly uniform coatings are required at reduced temperatures.
Low-Temperature Deposition for Sensitive Substrates
Plasma activation enables deposition at significantly lower temperatures than thermal ALD, making PEALD ideal for flexible electronics, advanced packaging, and organic semiconductor devices, where thermal budgets are limited.
High-Aspect-Ratio and Complex Structures
PEALD delivers excellent step coverage and conformality, ensuring consistent coatings on 3D architectures. This is critical in the semiconductor industry for high-k dielectrics, diffusion barriers, and gate oxides.
Learn more about our range of ALD systems below, or scroll on to learn more about why ALD plasma processing is vital to the future of semiconductor research and fabrication.
Advanced Energy Applications
In the energy sector, PEALD is widely adopted for protective coatings on lithium-ion batteries, fuel cells, and photovoltaic devices, improving cycle life, efficiency, and durability by preventing degradation at the nanoscale.
Advantages Over Other Plasma Processes
Unlike standard plasma-enhanced processes, PEALD is self-limiting, providing atomic-scale control over thickness and composition. Plasma activation also broadens material choice, enabling high-quality oxides, nitrides, and functional films with superior density and purity.
SENTECH ICPEALD, PEALD, and ALD systems
SENTECH ALD Systems are engineered to meet the most demanding application challenges in research and production. With inductively coupled plasma-enhanced ALD (ICPEALD), the SENTECH SI PEALD enables highly reactive, low-damage plasma processes ideal for advanced semiconductors and delicate substrates. The SENTECH SILAYO PEALD systems deliver superior conformality and material flexibility at reduced temperatures, making them the solution of choice for electronics and energy device applications. For thermal ALD, SENTECH provides precise, scalable platforms for depositing ultra-thin, pinhole-free films with exceptional uniformity. Together, these technologies ensure that whether you need atomic-level control, plasma-enhanced reactivity, or low-temperature deposition,
The ALD solutions from SENTECH reliably address your coating, integration, and performance requirements. Explore our product range.
