Plasma enhanced chemical vapour deposition tools
What are your key deposition application challenges?
Successful plasma deposition for thin film coatings, presents several challenges. The process relies on generating and sustaining a plasma, typically using gases like argon or oxygen, to deposit materials onto a substrate. One of the key difficulties is controlling the plasma’s properties—density, temperature, and energy distribution. Small variations can lead to inconsistent deposition rates, defects, or undesirable chemical reactions. Discover how working with SENTECH tools and systems can help you solve your deposition process challenges.
