ICPECVD Systems

Gain insight into our systems with low-damage, low-temperature capabilities for inductively coupled plasma-based CVD deposition processes.
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Plasma enhanced chemical vapour deposition tools

What are your key deposition application challenges?

Successful plasma deposition for thin film coatings, presents several challenges. The process relies on generating and sustaining a plasma, typically using gases like argon or oxygen, to deposit materials onto a substrate. One of the key difficulties is controlling the plasma’s properties—density, temperature, and energy distribution. Small variations can lead to inconsistent deposition rates, defects, or undesirable chemical reactions. Discover how working with SENTECH tools and systems can help you solve your deposition process challenges.

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Inductively Coupled PECVD System – SI 500 D

Inductively coupled (IC) PECVD system, the SENTECH SI 500 D for high density, low ion […]
SENTECH Depolab 200

PECVD Open Lid Plasma Deposition System – Depolab 200

The SENTECH Depolab 200 is the basic plasma-enhanced chemical vapour deposition (PECVD) system suited to […]
SENTECH SIPAR

SIPAR ICP Deposition System Combining PECVD and ALD in One Reactor

The inductively coupled plasma (ICP) deposition system SIPAR combines plasma-enhanced chemical vapour deposition (PECVD) and […]

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