Atomic Layer Deposition Systems

Find the best Atomic Layer Deposition System providing excellent uniformity and conformity for ultra-thin pinhole and particle-free films even down to just a few nanometers.

Precise thickness control and uniformity

Why is ALD the solution to your application challenges?

Atomic layer deposition (ALD) offers exceptional precision in thin-film growth. The sequential, self-limiting chemical reactions between gaseous precursors and a substrate, with each cycle depositing a single atomic layer offers precision, conformality and uniform deposition.

PEALD System with True Remote CCP Source – SI PEALD

The SENTECH True Remote CCP Source enables homogenous and conformal coating of sensitive substrates and […]

PEALD System for Optical Coatings on Large Substrates – SILAYO

The SENTECH SILAYO is a plasma-enhanced atomic layer deposition (PEALD) system for optical coatings and […]

AL Real Time Monitor

The SENTECH AL Real Time Monitor is a proven optical diagnostic tool allowing fast process […]

Plasma Process Technology

Plasma
Etching

PECVD
Systems

Cluster
Configuration

News

OptiRefS Project

Learn more about the OptiRefS project

The SENTECH Thin Film Metrology Seminar and Workshop 2024

Join us for a cutting-edge thin film metrology seminar and workshop!

Successful Characterisation of Dielectric Layers on SiC for Next-Gen Semiconductor Applications

Explore our latest research and request the full application note.

Wafer-level integration challenges of ALD for 2D materials

Find out about the collaboration between SENTECH and the Ruhr-Universität Bochum (RUB).

Analysing the earth’s heat balance to better understand global warming

The European Space Agency's satellite mission planned for 2027.

The SENTECH “Plasma Process Technology Seminar” 2024

Click here to find out more about the SENTECH Plasma Process Technology Seminar.