Key features & benefits
PEALD for best thin film uniformity < 1 %
The SENTECH SILAYO plasma enhanced atomic layer deposition (PEALD) system is designed for conformal and homogeneous optical coatings on large 3D objects and on batches of small substrates. The SENTECH proprietary Planar Triple Spiral Antenna (PTSA) provides a homogeneous plasma for homogeneous optical coatings.
Samples up to 330 mm diameter and 100 mm height
The SENTECH SILAYO PEALD system enables homogeneously coating samples up to 330 mm in diameter and a vertical dimension of up to 100 mm.
Stress control using rf bias
The optional rf-biased substrate electrode allows the modification of the layer properties (e.g. stress and refractive index).
The SENTECH SILAYO PEALD system extends the SENTECH ALD and PEALD product portfolio to deposition on 330 mm substrates and 3D substrates. In order to ensure excellent uniformity and conformality in layer-thickness PEALD is used for depositing optical thin films applied as e.g., anti-reflective coatings or optical filter systems. The SENTECH SILAYO uses the advantages of the SENTECH Planar Triple Spiral Antenna (PTSA) inductively coupled plasma (ICP) source in PEALD processing.
Flexibility and modularity
The SENTECH SILAYO PEALD system is designed for depositing materials on large and 3D-shaped substrates, especially for optical coatings with high requirements on layer performance such as, high precision in thickness and composition control, smooth surfaces and sharp interfaces,stress control, especially for high-thickness multilayer stacks,high uniformity and conformality on 3D shapes and, reduced deposition temperatures for low-damage processing.
The system can optionally be equipped with the proprietary technology of the SENTECH AL Real Time Monitor for in-situ monitoring.
The SENTECH SILAYO is controlled by the advanced hardware and SENTECH SIA software, with a client-server architecture. A well-proven, reliable progammable logic controller (PLC) is used for the real-time control of all components.