Plasma Etching
What are your plasma etching application challenges?
What is Plasma Etching? Understanding RIE and ICP-RIE
Plasma etching is a critical semiconductor fabrication process used to precisely remove material from a substrate using reactive ionised gases. Unlike traditional wet etching, plasma etching allows for highly anisotropic and controlled material removal, essential for modern microelectronics and nanofabrication. This process relies on a plasma, an ionised gas containing reactive species, that chemically and physically interacts with the surface of the substrate.
RIE (Reactive Ion Etching)
RIE is one of the most widely used plasma etching techniques. It combines chemical reactions and physical ion bombardment to etch patterns with high precision. RIE is ideal for achieving moderate anisotropy and is commonly used in photolithography-based pattern transfer for microchips, MEMS devices, and thin-film circuits.
ICP-RIE (Inductively Coupled Plasma Reactive Ion Etching)
ICP-RIE is an advanced variation that generates a high-density plasma through an inductively coupled RF source. ICP-RIE allows independent control of ion energy and plasma density, enabling deeper etching with higher precision, reduced substrate damage, and superior sidewall profiles. This makes ICP-RIE the preferred choice for high-aspect-ratio etching in applications such as advanced semiconductor devices, DRAM fabrication, and photonic components.
Applications and Industry Examples
Plasma etching is extensively applied in the semiconductor, MEMS, and LED industries. For example, it is used for etching silicon, silicon dioxide, and III-V compound semiconductors in integrated circuits. In the display industry, plasma etching enables precise patterning of thin films for OLED and LCD panels.
Process Advantages
Plasma etching offers unmatched precision, high selectivity, and excellent anisotropy. ICP-RIE further enhances throughput, uniformity, and etch rate control. These benefits make plasma etching indispensable for modern microfabrication, ensuring reliability and performance in high-tech devices.
SENTECH offers advanced ICP-RIE and RIE plasma etching systems designed for precision, flexibility, and versatility. Their tools deliver excellent control over etch rate, uniformity, and sidewall profiles, making them ideal for semiconductor, MEMS, and photonics applications. With modular configurations, user-friendly software, and high reliability, SENTECH systems adapt to a wide range of materials and processes. Whether for research or production, SENTECH plasma etchers provide flexible solutions with proven performance and reproducibility.
