ICP-RIE Plasma Etching:

Plasma_cryogenicSiPlasma_lithographyPlasma etching result of VCSEL structure using Ar-Cl2 gas mixtureEtching process result of Si-DRIE (SF6-C4F8-O2) post O2 cleanPlasma etching result of SF6-C4F8 based gas chopping process(IAP-Jena)ICP PECVD TEOS SiO2 film step coverage over Si ridge(IISB-Erlangen)ICP RIE result of SF6O2-C4F8-based Si gas chopping process

What's New?

SIPAR: New system for PEALD & ICPECVD in one reactor presented at ThGOT

SIPAR presentation at ThGOT

SENTECH offers leading edge plasma process technology equipment for etching and deposition, as well as thin film measurement instrumentation. We proudly presented our new combinatorial system “SIPAR” for PEALD & IC PECVD at the ThGOT conference (Thuringian surface days)....→read more

Application-oriented thin film measurement seminar

Thin film measurement SeminarSENTECH as a worldwide leader in thin film measurement and plasma process technology organizes application oriented seminars on a regular basis. The most recent seminar “Ellipsometry and Reflectometry for characterizing thin films” was on thin film measurement. →read more


Instruments GmbH

Schwarzschildstr. 2
12489 Berlin

Phone: +49 (0)30 63 92 55 20
Fax: +49 (0)30 63 92 55 22
Email: info@sentech.de


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