Meeting the challenges of advanced process development for the integration of atomic layer deposition (ALD) grown two-dimensional (2D) materials at wafer level

Using a SENTECH Cluster System, the “Research Laboratory Microelectronics Bochum for 2D Electronic Systems” (ForLab PICT2DES) project aims at attaining high-level applications in microelectronics and microsystems technology at a wafer level. The unique optical, thermal, and mechanical properties that exist in two-dimensional (2D) materials such as transition-metal dichalcogenides (TMDs) have extremely promising applications in the growing areas of micro-technologies including highly-sensitive sensors, ultra-thin logic devices, nanogenerators, electronics, and optoelectronic devices.

Although these materials pose some process challenges, the tunability of electrical and optical properties via the layer thickness of the 2D materials has great potential for future use cases. Ruhr-Universität Bochum (RUB) is working to establish a stable and scalable process chain, integrating additive and subtractive technologies with a high yield at a wafer level, that allows a transfer to industrial use. Working with the thinnest, 2D materials in electronics and sensors, 2D materials enable completely new, transparent, flexible, and biocompatible solutions with minimal consumption of resources.

A multidisciplinary team from SENTECH has been working closely with the team at Ruhr-Universität Bochum (RUB) to provide flexible and versatile equipment that will bridge the gap between research to applications in microelectronics and microsystems technology at a wafer level with Molybdenum Disulfide (MoS₂) 2D materials.

If you would like to find out more about how we overcame the process challenges for the atomic layer deposition (ALD) for ultra-thin 2D materials please request a full case study. To obtain your copy, simply send an email to marketing@sentech.de with your contact details and the company you are representing.