PECVD plasma deposition system Depolab 200
PECVD plasma enhanced chemical vapour deposition tool Depolab 200 combines parallel plate plasma source design with direct load.
According to its modular design, the PECVD Depolab 200 is upgradeable with larger pumping unit, low frequency power supply, and additional gas lines.
SENTECH control software
User-friendly powerful software is included with mimic GUI, parameter window, recipe editor, data logging, user management.
Depolab 200 is the basic plasma enhanced chemical vapour deposition (PECVD) tool by SENTECH combining the advantages of a parallel plate electrode design for uniform film deposition with cost effective design of direct load. Starting with standard applications on 2” to 8” wafers and sample pieces, it can be upgraded step by step for complex processing.
Outstanding features of the PECVD Depolab 200 are the rugged design of the system, the reliability, and the flexibility of the software and hardware. Different processes have been developed on the system
Depolab 200 plasma enhanced chemical vapour deposition tool is configured to deposit SiO2, SiNx, SiONx, and a-Si films in a temperature range up to
The PECVD Depolab 200 is operated by the SENTECH advanced control software using remote field bus technology and a very user-friendly general user interface.
- plasma enhanced chemical vapour deposition (PECVD) tool
- Open lid loading
- For up to
- Substrate temperature up to
- Optional low frequency mixing for low stress films
- Dry pumping unit
- Small footprint