RIE plasma etcher SI 591 compact
The RIE etcher SI 591 compact facilitates a large number of chlorine and fluorine based plasma etching processes.
Small footprint and high modularity
SI 591 compact can be configured as single reactor or as cluster tool with cassette-to-cassette loading.
SENTECH control software
Our plasma etching tools include user-friendly powerful software with mimic GUI, parameter window, recipe editor, data logging, and user management.
The SI 591 compact stands for excellent process reproducibility and plasma etching process flexibility due to the vacuum loadlock and fully computer controlled plasma etching process conditions. Flexibility, modularity, and a small footprint are design characteristics of the SI 591 compact. Samples up to
Large diagnostic windows located at top electrode and reactor can easily accommodate the SENTECH laser interferometer or OES and RGA systems. Ellipsometer ports are available for process monitoring using SENTECH insitu ellipsometers.
The SI 591 compact combines the advantages of a parallel plate electrode design for RIE with the fully computer controlled etch process conditions of the loadlock system. The SI 591 compact can be configured for processing of a variety of materials
III-V compound semiconductors
(GaAs, InP, GaN, InSb) Dielectrics Quartz Glass Silicon Silicon compounds (SiC, SiGe) Metals . At SENTECH we offer different levels of automation ranging from vacuum cassette loading to one process chamber up to six port cluster with different etch and deposition modules targeted to high flexibility or high throughput. The SI 591 compact is available as process module on cluster configuration as well.
- RIE plasma etching with small footprint
- Halogen and fluorine chemistry
- For up to
- Diagnostic windows for laser interferometer and OES
- Configurations of up to 6-port transfer chamber available
- Combination of RIE, ICP-RIE, and PECVD
- Manual vacuum loadlock or cassette station
- Cluster for
R & Dand high throughput
- SENTECH control software