ICPECVD系统

深入了解我们基于电感耦合等离子体的 CVD 沉积工艺系统的低损耗、低温功能。
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等离子体增强型化学气相沉积工具

PECVD and ICPECVD Explained - When Inductively Coupled PECVD is the Right Choice

Inductively Coupled Plasma Enhanced Chemical Vapor Deposition (ICPECVD) is an advanced form of PECVD (Plasma Enhanced Chemical Vapor Deposition) that delivers higher plasma density, improved film quality, and reduced substrate damage. ICPECVD is the best choice when industries require dense, uniform thin films at low deposition temperatures, outperforming conventional PECVD in many demanding applications.

Low-Temperature, High-Quality Thin Films

Like PECVD, ICPECVD enables deposition on temperature-sensitive substrates such as polymers, glass, and flexible electronics. However, ICPECVD’s inductively coupled plasma allows the growth of films with higher density, fewer defects, and better adhesion while maintaining low thermal budgets. This makes ICPECVD the preferred plasma processing option when standard PECVD cannot achieve the required film quality.

Semiconductor and Microelectronics Applications

In the semiconductor industry, PECVD is widely used for dielectric layers, passivation coatings, and barrier films. ICPECVD takes this further by delivering superior conformality and low-stress films such as silicon nitride, silicon oxide, and advanced dielectric stacks. These properties are essential for high-performance logic, memory, and photonic devices where film integrity is critical.

Energy and Photovoltaic Industries

PECVD is already a cornerstone technology in solar cell and battery manufacturing. ICPECVD enhances these applications by producing passivation layers, transparent conductive coatings, and protective barriers with improved density and durability, directly increasing device efficiency and lifetime.

While PECVD remains a versatile deposition method, ICPECVD is the best plasma processing option when industries demand denser, more uniform, and lower-damage films for next-generation electronics, renewable energy, medical devices, and optical systems.

SENTECH Instruments offers advanced ICPECVD and PECVD systems designed to deliver high-quality thin films for research and production. With inductively coupled plasma technology, SENTECH ICPECVD systems provide superior film density, low ion damage, and excellent step coverage at low deposition temperatures. Our PECVD systems are widely used for dielectric layers, passivation coatings, and protective films in semiconductors, photovoltaics, and optics. Whether you require standard PECVD versatility or the enhanced performance of ICPECVD, SENTECH systems ensure reliable, uniform, and scalable thin-film deposition tailored to your application needs.

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SI 500 D ICPECVD 系统

感应耦合(IC)PECVD 系统,即 SENTECH SI 500 D 用于高密度、低离子 [...]
SENTECH Depolab 200

Depolab 200 PECVD 开盖系统

Depolab 200 是适用于 [...] 的基本等离子体增强化学气相沉积 (PECVD) 系统。
SENTECH SIPAR

将 PECVD 和 ALD 结合在一个反应器中的 SIPAR ICP 沉积系统

电感耦合等离子体 (ICP) 沉积系统 SIPAR 结合了等离子体增强化学气相沉积 (PECVD) 和 [...]

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