Projects and Partnerships

SENTECH Instruments is currently involved within a number of projects, working together with universities, institutes, and companies in research and development of new innovations.

ZIM Wuppertal - Atomic layer etching (ALE) of semiconductors

zim_4c_kleinAtomic layer etching (ALE) of semiconductors The project intends to overcome the limits of established etching processes by using a new etching process. For this purpose, the atomic layer etching (ALE) is to be used. ALE is an analogy to the now widely used atomic layer deposition (ALD). SENTECH works on a transformation of an already existing plasma etching system into an ALE system. A focus will be the possibility of providing monoenergetic ions in the low energy range.

Project type: ZIM cooperation project

Project partner: Bergische Universität Wuppertal, Department of Electronic Components

ANAKONDA, continuous roll-to-roll deposition of transparent barrier layers

ANAKONDA is a cooperative project to develop a new and innovative plasma based deposition method for flexible barrier films. Within this project SENTECH will develop an advanced plasma ALD system for continuous deposition of barrier films on temperature-sensitive interlayers which are often used in photovoltaics and green technologies.

Partners of the project:Federal_Ministry_of_Education_and_Research

ANAKONDA is funded by BMBF.

TCO4CIGS

The project TCO4CIGS aims to improve the efficiency of thin film solar cells by optimizing the properties of the sub-layers. Within the project SENTECH Instruments will adapt and develop existing optical measurement and characterization methods for routine use in thin-film PV production. The main focus is on inline monitoring and large-scale survey.

Partners of the project are:

ZIM Cottbus

zim_4c_kleinThe overall objective of the project is the research and development of an atomic layer deposition (ALD) process for high-quality thin transparent-conductive mixed oxides of the In (Sn) Ga-Zn-oxide (IGZO) material class. The quaternary material system IGZO is highly attractive in terms of its applicability for transparent electrodes in photovoltaics, LEDs or energy-efficient windows, but especially in thin-film transistors for flexible or active matrix displays and in the, low-cost paper electronic '.

The use of the ALD method for the deposition of IGZO layers can significantly improve both the process control and the layer homogeneity.

project type: AiF Projekt GmbH, ZIM Kooperationsprojekt

project partners:

  • AMIC Angewandte Micro-Messtechnik GmbH
  • Arxes-tolina GmbH Dresden elektronik ingenieurtechnik GmbH
  • Becker photonik GmbH
  • DIAS Inrared GmbH DGzfP Ausbildung und Training GmbH
  • RHEFOR (Deutschland) GmbH
  • Teletronic Rossendorf GmbH Cp.max
  • Rotortechnik GmbH & Co. KG
  • Fraunhofer Institut für Keramische Technologien und Systeme, Institutsteil Materialdiagnostik (IKTS-MD), Außenstelle Berlin

SIMPLEX

PERC (Passivated Emitter and Rear Cell) is currently the only industrially, economically justifiable cell power increasing technology that meets the requirements for a good balance between manufacturing costs (US$/W) and efficiency, thus securing interesting payback periods for the investment. In this project basic research on very thin backside insulating layers is supported by high speed in-situ ellipsometry for monitoring the growth mechanism starting from the very first monolayer. ALD from SENTECH will be used to study a surface conformal layer with high density and thicknesses of about 10 nm. These studies will be accompanied by detailed plasma diagnostics contributed by our project partners.

Partners in this project are:

SNELLIUS

BMBF_RGB_Gef_M_eStandardization of ellipsometry as universal spectroscopy

Ellipsometry has long been used in manufacturing in the field of semiconductor technology and ellipsometry. Also in the FE segment it has developed out of semiconductor technology from VUV to the IR spectral range for universal spectroscopy. But it`s industrial application outside of semiconductor technology is nevertheless clear limited. First, ellipsometry is an indirect, model-based method in which the physical quantities of interest (layer thickness and optical / dielectric functions) must be determined through a parameterized fit. A model is indispensable.

The possible measurement accuracy of 0.1 nm under ideal conditions (ideally smooth and homogeneous substrates, very well-defined materials and valid models as it is the case with semiconductor applications) is confronted with significantly increased uncertainties and open questions of material-independent model validation in real systems on technical surfaces. On the other hand there are no generally accepted standards and standards for ellipsometry that include model validation outside the semiconductor industry. These two deficits should be reduced or eliminated promptly by means of SNELLIUS (standardization and standardization of ellipsometry as universal spectroscopy) In this way the use of ellipsometry is to accelerated in cross-material quality assurance outside of semiconductor technology.

Project promoter: BMBF

Project partner:

  • BAM
  • Accurion GmbH
  • DIN

rollerNIL - nanostructuring on large areas

The rollerNIL project aims at the replication of different kinds of complex optical nanostructures using roller-based nanoimprint lithography. Roll-to-roll as well as roll-to-plate nanoimprinting will be used. Master, material and quality controll issues will be treated as well.

Partners of the project:

FlexCoPlas, highly flexible precision coatings

FlexCoPlas

FlexCoPlas is a project to research highly flexible optical precision coatings on polymer surfaces.

Within this project, SENTECH Instruments will create a monitoring system which helps to produce these surfaces by  analyzing optical properties and the thickness of the coatings during the manufacturing process and of the final coatings.  Read more ...

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