Projects and Partnerships

SENTECH Instruments is currently involved within a number of projects, working together with universities, institutes, and companies in research and development of new innovations.

ANAKONDA, continuous roll-to-roll deposition of transparent barrier layers

ANAKONDA is a cooperative project to develop a new and innovative plasma based deposition method for flexible barrier films. Within this project SENTECH will develop an advanced plasma ALD system for continuous deposition of barrier films on temperature-sensitive interlayers which are often used in photovoltaics and green technologies.

Partners of the project:Federal_Ministry_of_Education_and_Research

ANAKONDA is funded by BMBF.


The project TCO4CIGS aims to improve the efficiency of thin film solar cells by optimizing the properties of the sub-layers. Within the project SENTECH Instruments will adapt and develop existing optical measurement and characterization methods for routine use in thin-film PV production. The main focus is on inline monitoring and large-scale survey.

Partners of the project are:


PERC (Passivated Emitter and Rear Cell) is currently the only industrially, economically justifiable cell power increasing technology that meets the requirements for a good balance between manufacturing costs (US$/W) and efficiency, thus securing interesting payback periods for the investment. In this project basic research on very thin backside insulating layers is supported by high speed in-situ ellipsometry for monitoring the growth mechanism starting from the very first monolayer. ALD from SENTECH will be used to study a surface conformal layer with high density and thicknesses of about 10 nm. These studies will be accompanied by detailed plasma diagnostics contributed by our project partners.

Partners in this project are:


BMBF_RGB_Gef_M_eStandardization of ellipsometry as universal spectroscopy

Ellipsometry has long been used in manufacturing in the field of semiconductor technology and ellipsometry. Also in the FE segment it has developed out of semiconductor technology from VUV to the IR spectral range for universal spectroscopy. But it`s industrial application outside of semiconductor technology is nevertheless clear limited. First, ellipsometry is an indirect, model-based method in which the physical quantities of interest (layer thickness and optical / dielectric functions) must be determined through a parameterized fit. A model is indispensable.

The possible measurement accuracy of 0.1 nm under ideal conditions (ideally smooth and homogeneous substrates, very well-defined materials and valid models as it is the case with semiconductor applications) is confronted with significantly increased uncertainties and open questions of material-independent model validation in real systems on technical surfaces. On the other hand there are no generally accepted standards and standards for ellipsometry that include model validation outside the semiconductor industry. These two deficits should be reduced or eliminated promptly by means of SNELLIUS (standardization and standardization of ellipsometry as universal spectroscopy) In this way the use of ellipsometry is to accelerated in cross-material quality assurance outside of semiconductor technology.

Project promoter: BMBF

Project partner:

  • BAM
  • Accurion GmbH
  • DIN

rollerNIL - nanostructuring on large areas

The rollerNIL project aims at the replication of different kinds of complex optical nanostructures using roller-based nanoimprint lithography. Roll-to-roll as well as roll-to-plate nanoimprinting will be used. Master, material and quality controll issues will be treated as well.

Partners of the project:

FlexCoPlas, highly flexible precision coatings


FlexCoPlas is a project to research highly flexible optical precision coatings on polymer surfaces.

Within this project, SENTECH Instruments will create a monitoring system which helps to produce these surfaces by  analyzing optical properties and the thickness of the coatings during the manufacturing process and of the final coatings.  Read more ...