Cluster Configuration for plasma etching & deposition


High throughput

Plasma Etching and deposition modules can be combined with up to two cassette stations for high throughput processing of up to 200 mm wafers.

Research & development

Three to six port transfer chambers are available for clustering ICP plasma etchers, RIE etchers, atomic layer deposition systems, PECVD and ICPECVD deposition tools to meet the requirements of R & D. Samples can be loaded via vacuum load lock and / or vacuum cassette station.

SENTECH cluster tools comprise plasma etching and / or deposition modules, transfer chamber, and vacuum load lock or cassette station. Transfer chambers including handling robot are available with three to six ports. Up to two cassette stations can be used to increase the throughput. The transfer chambers can be equipped with multiple options.

SENTECH cluster tools for R & D are operated by one graphical user interface, the SENTECH control software. Powerful control software is available for industrial high throughput cluster tools.

2017_First-Sensor_Totale_550pxPlasma Cluster Configuration with dual chamber architecture2017_FBH Cluster_bkgrdLow temperature plasma deposition clusterSI591_clusterIndustrial clusterCluster_SI500+SI500CCluster_SI500RIE

Industrial cluster

ICP-RIE plasma etching modules can be combined with two cassette stations for high throughput parallel processing of 200 mm wafers.


Modules of ICP-RIE, RIE, PECVD, and ICPECVD can be combined with vacuum load lock and / or cassette station to fulfill the special requirements of R & D.

Documents   To get more information, please click here.

Documents   To get more information, please click here.