Etchlab 200

RIE Plasma Etcher Etchlab 200
  • Low cost plasma etcher
  • Upgradeable with load lock
  • Upgradeable with turbopump
  • SENTECH’s control software
  • Up to 8" wafers and carriers
 
 
The RIE plasma etcher Etchlab 200 is a basic, cost effective tool fro dry etch processes in a R&D environment. Its modular design offers the stepwise upgrade of the pumping system, a load lock and a gas supply system to meet the requirements for challenging chemistries and tasks.

The Etchlab 200 is designed for modularity, process flexibility and simple use for all processes that are compatible with the wafer direct loading. Typical applications for the basic configuration are the etching of dielectrics (SiO2, Si3N4), semiconductors (Si), polymers and metals (Au, Pt, Ti, Ni).
 
Technical specifications:

Reactor298 mm diameter, AlMgSi 0.5 material, hinged lid
Substrate electrodewater cooled aluminum electrode,
electrode diameter 215 mm,
4" – 8" wafers and carriers for pieces and smaller wafers
Upper electrodehard coated aluminum with shower head and central window for optical endpoint detection
Vacuum systemanticorrosive backing pump, 16 m3/h, with CFS chemical filter and Fombline filled
Gas supply2 gas lines with MFC’s and cut off valve
RF power supply13.56 MHz RF generator, 600 W, air cooled
Control system

remote field controller, Interbus, basic interlocks realized by RFC

SoftwareSENTECH control software, including graphical interface, recipe control, powerful recipe editor and data logging
 
Options:
  • Vacuum loadlock
  • Larger pumping system including turbopump,
  • Additional gas lines for anticorrosive and corrosive gasses,
  • Circulation chiller,
  • Reactor heating,
  • Etch depth and endpoint detection system (NanoMes),
  • Optical emission monitor
 

Please contact us for more information.