RIE plasma etcher Etchlab 200

Cost-effectiveness

RIE plasma etcher Etchlab 200 combines parallel plate plasma source design with direct load.

Upgradeability

According to its modular design, Etchlab 200 is upgradeable with larger pumping unit, vacuum loadlock, and additional gas lines.

SENTECH control software

User-friendly powerful software is included with mimic GUI, parameter window, recipe editor, data logging, user management.
 

The Etchlab 200 RIE plasma etcher represents a family of direct load plasma etcher combining the advantages of a parallel plate electrode design for RIE with the cost effective design of direct load. The Etchlab 200 features simple and fast sample loading from parts to 200 mm or 300 mm diameter wafer directly onto the electrode or on carrier. Flexibility, modularity, and a small footprint are design characteristics of the Etchlab 200. Large diagnostic windows located at the top electrode and the reactor can easily accommodate the SENTECH laser interferometer or OES and RGA  systems. Ellipsometer ports are available for process monitoring using SENTECH insitu ellipsometers.

Etchlab 200 can be configured for processing of materials that are compatible with wafer direct loading, including but not limited to silicon and silicon compounds, compound semiconductors, dielectrics, and metals.

The Etchlab 200 is operated by the advanced SENTECH control software using remote field bus technology and a very user-friendly general user interface.