Plasma Cluster Configuration
Etching and deposition modules can be combined with up to two cassette stations for high throughput processing of up to
Research & development
Three to six port transfer chambers are available for clustering ICP etchers, RIE etchers, PECVD and ICPECVD deposition tools, vacuum loadlock and / or vacuum cassette station to meet the requirements of
SENTECH cluster tools comprise etching and / or deposition modules, transfer chamber, and vacuum loadlock or cassette station. Transfer chambers from three to six ports are available. Up to two cassette stations can be used to increase the throughput. The transfer chambers can be equipped with multiple options Options: ICP / RIE etcher modules ICPECVD / PECVD deposition modules Vacuum loadlock Vacuum cassette station High vacuum pumping unit .
SENTECH cluster tools for
ICP-RIE etching modules can be combined with two cassette stations for high throughput parallel processing of
Modules of ICP-RIE, RIE, PECVD, and ICPECVD can be combined with vacuum loadlock and / or cassette station to fulfill the special requirements of