Product News

SENTECH delivers the first SENDURO measurement system for 300 mm silicon wafer applications. The system allows the automated measurement of films whose thickness range between a few Angstrom and more than 50 µm. A robot loads the wafers automatically from a cassette station. The quick measurement of each point allows analysis of uniformity of coatings on 300 mm wafers by a multipoint measurement.   

Please contact us for more information or a demonstration