ICP-RIE Plasma Etching:

Plasma_cryogenicSiPlasma_lithographyPlasma etching result of VCSEL structure using Ar-Cl2 gas mixtureEtching process result of Si-DRIE (SF6-C4F8-O2) post O2 cleanPlasma etching result of SF6-C4F8 based gas chopping process(IAP-Jena)ICP PECVD TEOS SiO2 film step coverage over Si ridge(IISB-Erlangen)ICP RIE result of SF6O2-C4F8-based Si gas chopping process

What's New?

Plasma_Seminar_2017_03_09

SENTECH seminar Plasma Process Technology 2017 was once more a successful event to exchange knowledge about plasma tools and their applications. Invited speakers from industry and science gave presentations about etching, PECVD and PEALD and shared their experience with different applications. Current topics like homogeneous deposition, low-damage and high aspect ratio etching were discussed. →read more

ALD Reactor CNR IMM

The Institute for Microelectronics and Microsystems (CNR-IMM/1/) in Catania, Italy is using a SI PEALD LL tool with an 8-inch wafer configuration. The integration of novel high-k gate dielectrics and passivating layers on devices based on Gallium Nitride and other wide band gap semiconductors is investigated using SENTECH PEALD tool →read more

Upcoming Events:

Headbanner_elektrotech_2017


Headbanner_Control_GER_2017

Headbanner_CSW_GER_2017

Headbanner_Intersolar_2017

Quote-Button

SENTECH
Gesellschaft für Sensortechnik mbH

Konrad-Zuse-Bogen 13
82152 Krailling / KIM
Germany

Phone: +49 (0)89 - 89 79 60 70
Fax: +49 (0)89 - 89 79 60 722
Email: sales@sentech.de



Logo Sentech

SENTECH Instruments
Berlin, Germany

Logo_Freiberg_kurz

Freiberg Instruments
Freiberg, Germany